Ukusebenzisana kuya kunyusa inkqubo yokuveliswa kwe-silicon ye-300mm ukuhambisa iindleko, isikali kunye nomthamo olindelekileyo ukunika amandla ukuthunyelwa okuphezulu kwe-L-PIC yokuqhagamshelwa kweZiko loThintelo lwe-hyperscale Center kunye ne-5G ukuthunyelwa kwenethiwekhi kwi-100G, 400G nangaphaya.
I-90WG ye-GloFo, eyakhelwe kwitekhnoloji ye-90nm ye-SOI yenkampani isebenzisa ukuqhubekeka kweefayile ezingama-300mm, yenza amandla ukudityaniswa kwexabiso eliphantsi kwezixhobo ze-optical ezinjengeemodyuli, ii-multiplexers kunye nezinto zokuchonga kwisiza esinye se-silicon. Itekhnoloji ye-M-MIC ye-L-PIC isombulula umngeni oshiyekileyo wolungelelwaniso lwe-lasers kwi-silicon PIC.
Inkqubo ye-MACOM e-patent ye-Etched Facet Technology (EFT) enelungelo elilodwa lomenzi kunye nenkqubo yokuzibamba ye-EFT (SAEFT), ii-laser ze-MACOM zihambelana kwaye zixhonywe ngqo kwi-silicon Photonics ifa ngesantya esiphezulu kunye nokusebenza okuphezulu kokudibanisa, kuze ke kukhawuleziswe ukwamkelwa kweefotonikhi zesilicon izicelo zokwenyani zamashishini.
Umzi-mveliso ungena kumjikelo omde wokuhlaziya isantya esiphezulu sokunxibelelana ngaphakathi kwamaZiko eenkcukacha ze-iCloud kunye nokwakhiwa okubonakalayo kwe-5G. Ukuqikelelwa kwecandelo lezemali ngo-2019, 2020 nangaphaya kokuba yiminyaka eyomeleleyo yokukhula kweCoarse Wavelength Division Multiplexing (CWDM) kunye ne-PAM-4, ezinokubakho kwimfuno iyunithi iphela ngo-2019, ifikelela kwiiyunithi ezizigidi ezili-10.
Ngomrekhodo wokwenza ukuba kube lula ukuba kubekho amazibuko azizigidi ezi-1,6 ngonyaka ka-2016, amazibuko ezigidi ezi-4 ngo-2017, namazibuko ezigidi ezi-6 ngo-2018, iMACOM iza kusebenza ne-GF ukukala imveliso ye-L-PIC ejolise ekufezekiseni iimfuno zentengiso ezikhulayo.
"Ngemfuno yokuphindaphindeka kwebhendi ngaphakathi kuMaziko oDatha kunyaka ngamnye, ababoneleli ngeenkonzo zefu banikwa ubunzima bokufudukela kwi-100G nangaphaya. Ngaphezulu kwale nto, abathwali beTelecom ngoku bamkela imigangatho efanayo ye-CWDM kunye ne-PAM-4 yokwakheka kwenethiwekhi ye-5G. Isakhono sokukwazi ukusebenza ngokukuko kwinqanaba lokuhambisa umthamo kunye nokuveliswa kwemveliso kubaluleke kakhulu, utshilo uJohn Croteau, uMongameli kunye ne-CEO ye-MACOM.
"Ngokudibanisa ulwandiso lwamandla phakathi kwe-GF's silicon yeetekhnoloji ze-silicon kunye ne-MACOM's EFT Lasers, nokufudukela kuma-300mm wafile, sikholelwa ukuba le nkqubo intsebenzo iyasivumela ukuba sihlangabezane nemfuno yomzi-mveliso kwaye zisimise kwinkonzo yokuthengisa iminyaka ezayo."
"Sakhe isiseko esingakholelekiyo njengenkokeli ekunikezeleni izisombululo ze-silicon zefoto kunye nezinto eziphambili zokupakisha ezivumela abathengi bethu ukuba bakhe isizukulwane esitsha sezinto zokunxibelelana eziphezulu," utshilo umphathi weGloFo uTom Caulfield.
"Ngobuchwephesha bethu obunzulu bokwenza imveliso, kudityaniswe netekhnoloji eyomeleleyo ye-MACOM, sinakho ukuhambisa izisombululo zefoto ze-silicon ezahlukileyo kwinqanaba lesantya, ukukhawulezisa ukuhamba kwexesha ukuya kwimakethi, nokunciphisa iindleko zezicelo zamakhasimende kwiZiko leDatha kunye nenethiwekhi ye-5G yesizukulwane esilandelayo."